Type | Combining Rigid Circuit Board |
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Place Of Origin | Guangdong, China |
Material | Fiberglass Epoxy |
Base Material | FR4 (Tg130~Tg170) |
Insulation Materials | Epoxy Resin |
Type | Customizable |
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Usage | OEM Electronics |
Base Material | FR4 |
Min. Line Spacing | 3 Mil (0.075 Mm) |
Board Thickness | 1.6mm |
Type | Electronic PCB Assembly |
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Origin | Guangdong, China |
Service | PCB &PCBA Service |
Base Material | FR-4/Aluinum/CEM1/CEM3 PCB |
Other Service | Turnkey Assembly Service |
Place Of Origin | Guangdong, China |
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Base Material | Electroless Copper/rolling Copper |
Copper Thickness 12~50UM | 12~50UM |
Board Thickness | 0.075~0.16MM |
Min. Hole Size | 0.2mm |
Type | Rigid Circuit Board |
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Dielectric | FR-4 |
Material | Fiberglass Epoxy |
Insulation Materials | Organic Resin |
Brand | Fast PCB Technology |
Type | Rigid Circuit Board |
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Origin | Guangdong, China |
Base Material | Copper |
Insulation Materials | Metal Composite Materials |
Min Hole Size | 0.1mm (4 Mil) |
Board Material | Fr4 |
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Board Layer | 1-24 Layers |
Board Thickness | 0.2mm-6mm |
Copper Thickness | 0.5oz-2oz |
Min. Line Width/Space | 0.1mm |
Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
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Base Material | FR-4 |
Min. Line Spacing | 4/4mil(0.1/0.1mm) |
Board Thickness | 1.6mm-3.2mm |
Min. Line Width | 0.1mm/4mi |
Origin | Guangdong, China |
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Metal Coating | Copper |
Mode Of Production | SMT / DIP |
Base Material | FR-4 |
Layers | Multilayer |
Typy | Ceramic PCB , Customized |
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Place Of Origin | Guangdong, China |
Base Material | FR4,Rogers,Aluminum |
Copper Thickness | 0.5oz-8oz |
Board Thickness | 0.2mm-4mm |